Copenhagen, Denmark — 13 November 2025 — Skycore Semiconductors, a startup specializing in Power Integrated Circuit (IC) technology for next-generation AI data centers, today announced it has raised €5 million in seed funding. The round was led by the Amadeus APEX Technology Fund, with participation from First Momentum, Mätch VC, and Balnord.
Founded in Denmark, Skycore Semiconductors has developed a breakthrough Power IC technology platform that enables the development of power solutions for applications with extreme power density and efficiency demands. The company’s silicon-validated technology addresses the critical power infrastructure challenges facing next-generation AI data centers, particularly the emerging 800V High Voltage Direct Current (HVDC) architectures that promise to revolutionize data center power and compute density.
The company’s Power IC solutions deliver extreme power density and efficiency in a compact and flat form factor, addressing a critical bottleneck in scaling AI infrastructure. With a growing portfolio of 6 patent families and validated silicon technology, Skycore is developing the 800V HVDC power architectures that will power the next generation of AI factories.
“Skycore is solving the power bottleneck that’s limiting AI’s explosive growth,” said Ion Hauer, Principal at APEX Ventures. “Its Power IC technology isn’t just an incremental improvement—it’s a paradigm shift for 800V data center architectures and beyond. We’re thrilled to back a team that will define how the world powers AI infrastructure.”
The fresh capital will be used to expand the team across both technical and business development functions, accelerate product development and manufacturing capabilities, strengthen the company’s patent portfolio, and establish a robust and scalable supply chain. The company will also execute co-development projects with potential customers and deepen engagement with strategic partners. This funding addresses an urgent industry challenge: today’s AI factories are hitting the physical limits of 54 VDC power distribution, with copper busbars unable to efficiently serve racks exceeding 200 kW. As Nvidia’s recent announcement confirms, the industry is racing toward 800V HVDC architectures to overcome these constraints—making Skycore’s power-dense IC solutions essential for the AI infrastructure of tomorrow (1).
“Scaling today’s AI compute infrastructure requires a fundamental change in how data centers are powered, and 800V HVDC power architectures are the first step on that path,” said Pere Llimós Muntal, CEO and Co-founder of Skycore Semiconductors. “Our Power IC technology platform delivers power solutions with extreme power density and efficiency in flat, compact form factors, all essential to enable HVDC architectures. We design our solutions to be inherently scalable, to meet the evolving demands of future power architectures. This funding enables us to accelerate our market entry from validated silicon to market-ready products, positioning Skycore as a key enabler of next-generation data center power delivery.”
Skycore is a Startup Member of the Open Compute Project (OCP), the largest collaborative community focused on redesigning hardware to efficiently meet the growing demands of compute infrastructure. The company is also a member of the Berkeley Power & Energy Center (BPEC) at the University of California, joining prominent industry members including Nvidia, Google, Intel, Tesla, and Analog Devices.
Previous investors include Morph Capital and Thorbjørn Rønje, who led earlier funding rounds that, combined with grants, provided €2.5M to validate the company’s technology and build initial partnerships.
Today, Skycore’s 8-person team plans modest growth while focusing on commercializing its Power IC solutions with strategic partners. The company is working towards market entry with its first commercial products, leveraging its validated technology platform and strategic partnerships to capture the rapidly growing market for AI data center power solutions.
Looking ahead, Skycore’s vision is to become the global leader in Power Integrated Circuit solutions for high-voltage architectures in next-generation AI data centers and other applications with extreme power demands.
